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What M5 Pro, M5 Max get using vertically-stacked dies for performance

Apple’s chip designs for the M5 Pro and M5 Max stack the dies, using the same UltraFusion architecture that enabled the creation of Apple’s Ultra chips. Here’s how and why that’s faster than before.

Two glowing square Apple chip graphics on black background: left shows Apple logo with text M5 Pro in blue gradient, right shows Apple logo with text M5 Max in purple gradient
M5 Pro, M5 Max – Image credit: Apple

The M5 Pro and M5 Max are very powerful chips, but getting that high performance required the engineers to come up with new ways to design the chips in the first place. In the latest releases, Apple actually borrowed an idea from its Ultra line for its M5 chip packing.

Speaking to Heise Online in an article spotted by WCCFTech, Anand Shimpi of Apple’s Hardware Technologies department explained that the UltraFusion architecture of the M2 Ultra and M3 Ultra helped create the M5 Pro and Max.

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